{"id":55328,"date":"2026-09-08T14:20:59","date_gmt":"2026-09-08T08:50:59","guid":{"rendered":"https:\/\/dailynewsindia.co.in\/index.php\/2026\/09\/08\/asml-secures-tsmc-samsung-and-intel-commitments-for-next-generation-euv-chip-manufacturing\/"},"modified":"2026-09-08T14:20:59","modified_gmt":"2026-09-08T08:50:59","slug":"asml-secures-tsmc-samsung-and-intel-commitments-for-next-generation-euv-chip-manufacturing","status":"publish","type":"post","link":"https:\/\/dailynewsindia.co.in\/index.php\/2026\/09\/08\/asml-secures-tsmc-samsung-and-intel-commitments-for-next-generation-euv-chip-manufacturing\/","title":{"rendered":"ASML Secures TSMC, Samsung, and Intel Commitments for Next-Generation EUV Chip Manufacturing"},"content":{"rendered":"
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New Delhi [India], September 8:<\/strong> ASML, the Dutch powerhouse in lithography, just pulled off a big win for the semiconductor world. It got firm commitments from the three biggest chipmakers\u2014TSMC, Samsung, and Intel\u2014to use its next-generation High-NA EUV technology. They announced the deal together right before the SPIE Bacus Conference in Monterey, California. Basically, all three are on board to move from the old 6-inch photomask standard to a much bigger 12-inch one. There\u2019s a pilot line set for 2031, with full production lined up for 2033.<\/p>\n

This isn\u2019t just a minor upgrade. It\u2019s a major turning point for chipmaking, especially for AI. With everyone moving together, the supply chain can finally keep up with the sky-high demand for powerful processors driving artificial intelligence.<\/p>\n

Here\u2019s what\u2019s really at stake. The new High-NA EUV machines cost up to $400 million each\u2014a hefty price, but worth it. These tools can carve out details almost twice as small as the last generation, which means you can fit triple the number of transistors on a chip. For AI, that\u2019s a huge deal. More transistors equal more brainpower for next-gen processors.<\/p>\n

Switching to 12-inch photomasks isn\u2019t a small thing, either. This move directly tackles some of the current bottlenecks chipmakers face. By doubling the mask size, companies can print way bigger chips\u2014like the ones Nvidia uses in data centers\u2014without having to \u201cstitch\u201d separate sections together. That \u201cstitching\u201d can mess with complexity and cause defects. ASML figures this upgrade could boost productivity by about 40%, making each chip cheaper to crank out.<\/p>\n

So, who\u2019s moving first? Here\u2019s how the timeline shakes out:<\/p>\n

Samsung wants to lead in memory tech and plans to roll out High-NA EUV for DRAM manufacturing as soon as 2028. That would make it the first to bring this new gear into mass production for memory chips.<\/p>\n

TSMC, the top name in contract chipmaking, is targeting 2030 to use High-NA for its advanced logic chips. As AI keeps evolving, TSMC expects it\u2019ll need High-NA machines for more layers of a chip.<\/p>\n

Intel\u2019s already in the game. It has High-NA machines installed and is putting them to work for high-volume logic production, cementing its spot as an early adopter.<\/p>\n

All this news lands while ASML is riding a high wave of demand. Earlier this year, SK Hynix put in a massive $7.9 billion order\u2014the biggest in ASML\u2019s history. With that, ASML is sticking with its ambitious revenue goals, aiming for \u20ac44 billion to \u20ac60 billion by 2030.<\/p>\n

By teaming up, TSMC, Samsung, and Intel are making it crystal clear: ASML holds the keys to the future of chipmaking. This shift to High-NA EUV and bigger masks isn\u2019t just a nice-to-have. If the industry wants to keep pushing AI forward, it\u2019s absolutely necessary.<\/p>\n<\/div>\n","protected":false},"excerpt":{"rendered":"

New Delhi [India], September 8: ASML, the Dutch powerhouse in lithography, just pulled off a big win for the semiconductor world. It got firm commitments from the three biggest chipmakers\u2014TSMC, Samsung, and Intel\u2014to use its next-generation High-NA EUV technology. They announced the deal together right before the SPIE Bacus Conference in Monterey, California. Basically, all…<\/p>\n

Read More “ASML Secures TSMC, Samsung, and Intel Commitments for Next-Generation EUV Chip Manufacturing”<\/span> »<\/a><\/p>\n","protected":false},"author":1,"featured_media":55329,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[4],"tags":[54],"class_list":["post-55328","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-business","tag-business"],"_links":{"self":[{"href":"https:\/\/dailynewsindia.co.in\/index.php\/wp-json\/wp\/v2\/posts\/55328","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/dailynewsindia.co.in\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/dailynewsindia.co.in\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/dailynewsindia.co.in\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/dailynewsindia.co.in\/index.php\/wp-json\/wp\/v2\/comments?post=55328"}],"version-history":[{"count":0,"href":"https:\/\/dailynewsindia.co.in\/index.php\/wp-json\/wp\/v2\/posts\/55328\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/dailynewsindia.co.in\/index.php\/wp-json\/wp\/v2\/media\/55329"}],"wp:attachment":[{"href":"https:\/\/dailynewsindia.co.in\/index.php\/wp-json\/wp\/v2\/media?parent=55328"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/dailynewsindia.co.in\/index.php\/wp-json\/wp\/v2\/categories?post=55328"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/dailynewsindia.co.in\/index.php\/wp-json\/wp\/v2\/tags?post=55328"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}